Filtered Search Results
| Name Note | 80 mesh woven from 0.14mm (0.0055 in.) dia. wire |
|---|---|
| Form | Wire Cloth |
| Health Hazard 3 | P201-P202-P260-P264b-P270-P272-P280g-P281-P302+P352-P308+P313-P333+P313-P363-P501c |
| MDL Number | MFCD00148499 |
| Health Hazard 2 | GHS H Statement H372-H351-H317 Causes damage to organs through prolonged or repeated exposure. Suspected of causing cancer. May cause an allergic skin reaction. |
| Solubility Information | Insoluble in water. |
| Health Hazard 1 | H317-H350-H372 |
| Chemical Name or Material | Stainless Steel gauze, Type 316 |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Odor | Odorless |
| Mesh Size | 80 Mesh |
| Avg. Mol. Wt. or Mol. Wt. Range | Fe:Cr:Ni:Mo; 67.5:17:13:2.5 wt% |
Lanthanum nickel, REacton™, 99.9% (REO)
CAS: 12196-72-4 Molecular Formula: LaNi5 Molecular Weight (g/mol): 432.37 MDL Number: MFCD00198177 InChI Key: BUCVQDCWULHLJZ-UHFFFAOYSA-N Synonym: lanthanum nickel,lani5,lanthanum pentanickel,lanthanum, compd. with nickel 1:1,lanthanum-nickel alloy,acmc-1brhe,lanthanum nickel, reacton,lanthanum nickel powder,-100 mesh,lanthanum nickel eutectic pieces, reacton,hy-stor™ 205 lanthanum-nickel alloy PubChem CID: 14367487 IUPAC Name: lanthanum;nickel SMILES: [Ni].[Ni].[Ni].[Ni].[Ni].[La]
| PubChem CID | 14367487 |
|---|---|
| CAS | 12196-72-4 |
| Molecular Weight (g/mol) | 432.37 |
| MDL Number | MFCD00198177 |
| SMILES | [Ni].[Ni].[Ni].[Ni].[Ni].[La] |
| Synonym | lanthanum nickel,lani5,lanthanum pentanickel,lanthanum, compd. with nickel 1:1,lanthanum-nickel alloy,acmc-1brhe,lanthanum nickel, reacton,lanthanum nickel powder,-100 mesh,lanthanum nickel eutectic pieces, reacton,hy-stor™ 205 lanthanum-nickel alloy |
| IUPAC Name | lanthanum;nickel |
| InChI Key | BUCVQDCWULHLJZ-UHFFFAOYSA-N |
| Molecular Formula | LaNi5 |
Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
| PubChem CID | 23978 |
|---|---|
| CAS | 7440-50-8 |
| Molecular Weight (g/mol) | 63.55 |
| ChEBI | CHEBI:30052 |
| MDL Number | MFCD00010965 |
| SMILES | [Cu] |
| Synonym | cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer |
| IUPAC Name | copper |
| InChI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
| Molecular Formula | Cu |
| Color | White |
|---|---|
| Physical Form | Liquid |
| Chemical Name or Material | Gallium Indium Tin eutectic |
| Density | 6.359 |
| Assay Percent Range | 99.99% (Metals basis) |
| Health Hazard 3 | P234-P260-P264b-P271-P280-P301+P330+P331-P303+P361+P353-P304+P340-P305+P351+P338-P310-P363-P390-P501c |
| MDL Number | MFCD00144388 |
| Solubility Information | Insoluble in water or organic solvents. |
| Health Hazard 1 | H290-H314-H335 |
| DOT Information | DOT Class: 8, Packing Group: III |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Molecular Formula | Ga:In:Sn; 62:22:16 wt.% |
| Odor | Odorless |
| Melting Point | 10.7°C |
| Form | Wire |
|---|---|
| Health Hazard 3 | P201-P202-P260-P264b-P270-P272-P280g-P281-P302+P352-P308+P313-P333+P313-P363-P501c |
| MDL Number | MFCD00801098 |
| Color | Silver |
| Health Hazard 1 | H317-H350-H372 |
| Chemical Name or Material | Copper Nickle |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Molecular Formula | Cu:Ni 55:45 wt% |
| Odor | Odorless |
| Appearance | Silver-colored wire |
Platinum Iridium wire, 0.25mm (0.01in) dia, annealed, 99.9+% (metals basis)
CAS: 6-4-7440 Molecular Formula: Pt Molecular Weight (g/mol): 195.08 MDL Number: MFCD00011179 InChI Key: BASFCYQUMIYNBI-UHFFFAOYSA-N Synonym: black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion PubChem CID: 23939 ChEBI: CHEBI:33400 IUPAC Name: platinum SMILES: [Pt]
| PubChem CID | 23939 |
|---|---|
| CAS | 6-4-7440 |
| Molecular Weight (g/mol) | 195.08 |
| ChEBI | CHEBI:33400 |
| MDL Number | MFCD00011179 |
| SMILES | [Pt] |
| Synonym | black,platin,sponge,platinum, metal,platinum, elemental,platine,platino,metal,platin german,iv ion |
| IUPAC Name | platinum |
| InChI Key | BASFCYQUMIYNBI-UHFFFAOYSA-N |
| Molecular Formula | Pt |
Thermo Scientific Chemicals Devarda's Alloy, granular
CAS: 8049-11-4 Molecular Formula: Al9Cu10Zn Molecular Weight (g/mol): 943.67 MDL Number: MFCD00198176 InChI Key: MPKKOQSNGWAMJD-UHFFFAOYSA-N Synonym: devarda's alloy,devarda's alloy, granular,al.cu.zn,devarda's alloy, p.a.,alumane copper zinc,devarda's alloy, puriss. p.a.,devarda's alloy, saj special grade,devarda's alloy, powder,-100 mesh,devarda's alloy, filings, +100 mesh,devarda inverted exclamation mark s alloy PubChem CID: 16211762 IUPAC Name: aluminum;copper;zinc SMILES: [Al].[Cu].[Zn]
| PubChem CID | 16211762 |
|---|---|
| CAS | 8049-11-4 |
| Molecular Weight (g/mol) | 943.67 |
| MDL Number | MFCD00198176 |
| SMILES | [Al].[Cu].[Zn] |
| Synonym | devarda's alloy,devarda's alloy, granular,al.cu.zn,devarda's alloy, p.a.,alumane copper zinc,devarda's alloy, puriss. p.a.,devarda's alloy, saj special grade,devarda's alloy, powder,-100 mesh,devarda's alloy, filings, +100 mesh,devarda inverted exclamation mark s alloy |
| IUPAC Name | aluminum;copper;zinc |
| InChI Key | MPKKOQSNGWAMJD-UHFFFAOYSA-N |
| Molecular Formula | Al9Cu10Zn |
| Name Note | 0.075mm (0.003 in.) dia. |
|---|---|
| Form | Wire |
| MDL Number | MFCD00801098 |
| Chemical Name or Material | Copper Nickel wire |
| Synonym | Constantan |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Weight | ≈0.04g/m |
| Avg. Mol. Wt. or Mol. Wt. Range | Cu:Ni 55:45 wt% |
Stainless Steel gauze, 20 mesh woven from 0.382mm (0.015in) dia wire, Type 304
Filtration, electrodes
| Name Note | Woven from 0.382mm (0.015 in.) dia. wire |
|---|---|
| Form | Wire Cloth |
| MDL Number | MFCD00148499 |
| Solubility Information | Insoluble in water. |
| Chemical Name or Material | Stainless Steel gauze, Type 304 |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Mesh Size | 20 mesh |
| Avg. Mol. Wt. or Mol. Wt. Range | Fe:Cr:Ni; 70:19:11 wt% |
| Name Note | 1.6mm (0.062 in.) thick |
|---|---|
| Form | Foil |
| Health Hazard 3 | P201-P202-P261-P272-P280g-P281-P302+P352-P308+P313-P333+P313-P363-P501c |
| MDL Number | MFCD00801098 |
| Health Hazard 2 | GHS H Statement H351-H317 Suspected of causing cancer. May cause an allergic skin reaction. |
| Health Hazard 1 | H317-H351 |
| Chemical Name or Material | Nickel Copper foil, Alloy 400 |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Avg. Mol. Wt. or Mol. Wt. Range | Ni:Cu; 67:33 wt% |
Aluminum, silver coated powder, -200 mesh, 99.9% (metals basis), Ag 19-21 wt%
CAS: 11145-27-0 Molecular Formula: AlSi Molecular Weight (g/mol): 55.067 MDL Number: MFCD05865335 InChI Key: CSDREXVUYHZDNP-UHFFFAOYSA-N Synonym: silicon aluminum,aluminum-silicon alloy,al.si,aluminum silicon slug,aluminum silicon,aluminum-silane 1/1,aluminum silicon powder,-325 mesh,aluminum silicon slug, 6.35mm 0.25in dia x 6.35mm 0.25in length,aluminum silicon slug, 12.7mm 0.5in dia x 12.7mm 0.5in length, puratronic,aluminum silicon slug, 6.35mm 0.25in dia x 12.7mm 0.5in length, puratronic PubChem CID: 9793685 IUPAC Name: aluminum;silicon SMILES: [Al].[Si]
| PubChem CID | 9793685 |
|---|---|
| CAS | 11145-27-0 |
| Molecular Weight (g/mol) | 55.067 |
| MDL Number | MFCD05865335 |
| SMILES | [Al].[Si] |
| Synonym | silicon aluminum,aluminum-silicon alloy,al.si,aluminum silicon slug,aluminum silicon,aluminum-silane 1/1,aluminum silicon powder,-325 mesh,aluminum silicon slug, 6.35mm 0.25in dia x 6.35mm 0.25in length,aluminum silicon slug, 12.7mm 0.5in dia x 12.7mm 0.5in length, puratronic,aluminum silicon slug, 6.35mm 0.25in dia x 12.7mm 0.5in length, puratronic |
| IUPAC Name | aluminum;silicon |
| InChI Key | CSDREXVUYHZDNP-UHFFFAOYSA-N |
| Molecular Formula | AlSi |
Stainless Steel wire, 0.38mm (0.015in) dia, annealed, Type 304
Temper: soft | Fe:Cr:Ni; 70:19:11 wt%
| Name Note | annealed, Type 304 |
|---|---|
| Form | Wire |
| MDL Number | MFCD00148499 |
| Color | Silver |
| Solubility Information | Insoluble in water. |
| Chemical Name or Material | Stainless Steel |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Molecular Formula | Fe:Cr:Ni; 70:19:11 wt% |
| Odor | Odorless |
| Appearance | Silver-colored wire |
| Name Note | 0.127mm (0.005 in.) dia., Annealed, Temper: soft |
|---|---|
| Percent Purity | 99.9% |
| Form | Wire |
| MDL Number | MFCD02091683 |
| Solubility Information | Insoluble in water and acid. |
| Chemical Name or Material | Platinum Iridium wire |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Assay Percent Notes | (metals basis excluding precious metals) |
| Odor | Odorless |
| Weight | ≈0.03g/10cm |
| Avg. Mol. Wt. or Mol. Wt. Range | Pt:Ir; 90:10 wt% |
| Percent Purity | 99.95% |
|---|---|
| Form | Lump |
| MDL Number | MFCD00143771 |
| Chemical Name or Material | Bismuth Tin eutectic lump |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Assay Percent Notes | (metals basis) |
| Melting Point | 138°C |
| Avg. Mol. Wt. or Mol. Wt. Range | Bi:Sn; 58:42 wt% |
| Name Note | 0.05mm (0.002 in.) dia. |
|---|---|
| Concentration or Composition (by Analyte or Components) | Au 99.99% |
| Percent Purity | 99.95% |
| Form | Wire |
| MDL Number | MFCD00011461 |
| Chemical Name or Material | Tungsten wire, gold plated |
| TSCA | Yes |
| Recommended Storage | Ambient temperatures |
| Assay Percent Notes | (metals basis) |
| Weight | ≈0.02g/m (W only), 3 to 5 wt% Au plating |